LQGM2060/3060

Automatic CNC Silicon Ingot Rounding and Granding Machine


For the rounding and grinding process of semiconductor silicon ingot

Good stability


For the rounding and grinding process of semiconductor silicon ingot
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Product Features

 

Multiple processing specifications

6~8-inch/12-inch silicon ingots, ingot length: 600/450mm.

Full-featured equipment

Silicon ingot crystal orientation detection, rounding, OF surface, V-NOTCH groove can achieve fully automatic grinding.

High degree of automation

Automatic processing, loading and unloading, alignment, detection and other functions.

High configuration

The control system is OMRON, equipped with automatic lubrication system.

High stability

Optimised design on the basis of the mature grinding machine structure in the photovoltaic industry, specially used for grinding silicon ingots in the semiconductor industry.

Reasonable mechanical structure design

Integral one-piece welding base, fixture and conveyor are located above the equipment, which is convenient for equipment maintenance.

 

 

Technical Parameters


Ingot Diameter 6-8 inch/12 inch
Ingot length 600mm/450mm
Ellipticity ≤0.06mm
Conicity ≤0.06mm
Diameter accuracy ±0.06mm
Surface roughness Ra≤1μm
OF width ±0.1mm
V-NOTCH depth 1.0~1.5mm
V-NOTCH angle 89°~93°(customizable)
Top R Angle Shape R0.9~0.94mm(customizable)
Device Size 4900x2810x2350mm
Total Power 30kW
Equipment weight 10.5t

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