LQJD33250P

Diamond Wire Cutting Machine


For the cut-off process of semiconductor silicon ingot

Optional automatic robot


For the cut-off process of semiconductor silicon ingot
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Product Features

 

Automatic loading safety protection

Silicon ingots are automatically loaded by truss robot, equipped with safety protection net and safety grating.

Stable cutting with gantry structure

The cutting head adopts gantry double column structure with stable and reliable structure, low failure rate, high cutting efficiency and high precision.

Automatic material return and convenient handling

The truncated silicon ingots are automatically return to the unloading area, which is convenient for unloading and transfer, customer can choose the full-automatic unloading device.

Convenient operation with wireless handle

The feeding conveyor and cutting instrument are equipped with wireless operation handle, which is convenient to operate the left,right,up and down movement, and convenient to change the ring wire and cutting wheel.

Support work order scanning and laser coding

Optional work order scanning and laser coding function.

Optional automatic robot

optional robot automatic sample taking device.

 


Technical Parameters


Processing specifications 8inch / 12inch
Processing length 2500mm
Sample thickness ≥1.3mm
Roughness Ra<3 μ m
Cutting line speed 0.50/0.65mm
Running line speed ≤0.2mm
Machine dimensions 4500×3860×3600mm
Total power 9.5kW
Total mass of machine 9t

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