Single loop-wire re-cropper QDHA35100
Features
1、Leading concept, achieving automation of re-cropping process through servo feeding platform docking with work pieces
2、Efficient and stable, optional dual wire dual servo tension configuration, achieving one-time sampling
3、Algorithm updates to optimize tension control, feed processes and improve finished product quality
Wet chemical texturing equipment
Product function
1.Removing the damaged layer and surface dirt during wiresawing
2.Using strong alkali to etch the crystalline silicon surface to form a regular pyramidal suede, Increasing the absorption of sunlight and reduce the reflectivity of the silicon wafer
3.Increasing the surface area of the silicon wafer, then the PN junction area also increases accordingly
Dual loop-wire cropper QDHZ35850
Features
1、Unique mode achieving automation of head and tail cutting and auto sampling
2、High speed and efficiency, complete all processes in one cutting, with a unit production of ≥ 6GW
3、Automatic centering, combined with multiple auxiliary supports, improves surface verticality and reduces chipping
Dual station cropper QDHS35850
Features
1、Innovative concept, single wire dual workstations, cutting and unloading at the same time, improving automation turnover rate
2、Pre-detection, increasing fixed length segment ratio, with a unit production of ≥ 3GW
3、Back-end loading, equipped with high-precision detection mechanism, with a length error of ≤ 0.2mm
Quad loop-wire squarer QHFA2395
Features
1、Capable of achieving ultra-high unit production capacity of 1GW
2、Equipped with a rotary workbench, with a preparing time of ≤ 30 seconds
3、Simultaneous cutting of four loop-wires, combined with tension control algorithm, with a range error of ≤ 0.15mm
Grinding / chamfering machine LT-GMS2510
Features
1、Automatic loading and centering, intelligent positioning of the work piece and improved compatibility with abnormal ingots.
2、Automatic detection of the margin, intelligent matching of the depth of grinding, improve machining efficiency ≤ 30s
3、Automatic detection of tool wear, intelligent replenishment of wear, and improvement of finished product accuracy
4、Automatic five dimensional correctable feeding table, capable of meeting the minimum unilateral 0.1mm allowance grinding
Slicer QP950
Features
1、Minimum and adjustable horizontal and vertical shaft distance
2、Up to 19 positions available, adjustable shaft distance 310-410mm
3、Fully compatibility with half wafers, full wafers and rectangular wafers
4、Meets the automation requirements of loading and unloading from the front, middle, and back ends
Half wafer slicer QP1200
Features
1、Minimum and adjustable horizontal and vertical shaft distance
2、Half wafer or full wafer spec compatible and up to 19 positions available, adjustable shaft distance 310-410mm
3、Maximum compatible brick length up to 1200mm
4、Meets the automation requirements of loading and unloading from the front, middle, and back ends
Half brick grinding / chamfering machine
Features
1、Fully automatic integrated machine, single station squaring + dual station surface grinding + four station chamfering, comprehensively improving processing efficiency
2、Full detection of work piece length, width, and height, accurate squaring positioning, loop-wire + servo tension mode, improving range error and reducing silicon loss
3、Adoption of roughing and finishing nested type electric spindle, together with the detection and compensation system, to ensure the dimensional accuracy of finished products
4、High unit production capacity, compatible with half brick processing, lower investment and higher output.
KX380PV
It can be compatible with up to 40 inches hotzone, to meet the growth needs of more silicon inputing and larger specifications of ingot, and it reserves a variety of upgradable modules, and the technology upgrade is cost-effective.
KX380PV-MCZ
It can meet the needs of low oxygen crystal pulling, higher MCLT requirement and our multi-configuration optional can provide customers more space of model choices.
KX420PV
It can be compatible with up to 42inches hotzone, to meet the growth needs of more silicon inputing and larger specifications of ingot, and it reserves a variety of upgradable modules, and the technology upgrade is cost-effective.
KX460PV
It can be compatible with up to 42inches hotzone, to meet the growth needs of more silicon inputing and larger specifications of ingot, and it reserves a variety of upgradable modules, and the technology upgrade is cost-effective.
Wet etching equipment
Product function
Removing back PSG and polishing
Wet chemical texturing equipment
Product function
1.Using strong alkali to polish the back of the silicon wafer to form a suede structure similar to a mirror surface to improve wafer's absorption of long wave
2.Increasing the thickness uniformity of the back passivation film
3.Reducing surface area of the back, improving MCLT, and reducing the back recombination rate
RCA Trough cleaning equipment
Product function
1.Removing PSG
2.Removing polycrystalline silicon deposits from the front (LPCVD)PECVD wound coating, and removing the remaining BSG on the surface
Wet chemical texturing equipment
Product function
1.Removing the damaged layer and surface dirt during wiresawing
2.Using strong alkali to etch the crystalline silicon surface to form a regular pyramidal suede, Increasing the absorption of sunlight and reduce the reflectivity of the silicon wafer
3.Increasing the surface area of the silicon wafer, then the PN junction area also increases accordingly
Back polishing and cleaning equipment
Product function
Polishing the wafer
Chemical texturing and cleaning equipment
Product function
The front suede surface of the wafer is generated, and the back area will open
Automatic degumming machine
Product function
Degumming the wafer after slicing
Automatic silicon cleaner
Product function
Main functions: With HF+HNO3 mixed acid corrosion cleaning and reagent (weak acid) soaking, cleaning function
Fully automatic wafer degummer&singulator&cleaner
Equipped with absorbent plate, cassette positioning, slow lifting, drying tank and other patented technology, which can separate wafers efficiently and reduce the broken rate
Japanese Keentu bus communication system and absolute bus servo are adopted, whcih can quickly grasp the processing of production data and achieve intelligent monitoring，which is compatible with various specifications of silicon chip sizes and switching time between different sizes does not exceed 4 hours
Fully automatic wafer degummer&singulator&cleaner
Whole cutter feeding，continuous wafer loading and inserting to improve the production capacity. In addition, through the improvement of the mechanism, the basket changing time is minimized, so that the production capacity of the whole machine is released to the best
Wafer degumming, inserting and cleaing integrated and are automatic, whcih can reduce the turnover link; loading fully automatic, one operator can handle several machines, which can save manpower
Microwave heating and water quenching roller crushing line
Equipment configuration
This equipment use microwave heating and water quenching to achieve continuous production, reduce pollution, reduce the purpose of silicon loss.
After microwave heating and water quenching, the polysilicon raw material will be more convenient to be loaded into the furnace, the crystal block is heated evenly, and it is easier to melt.
Brick aotomatic microwaving heating line
Specification of the equipment
It is used in the siliocn brick gluing process
We use microwave continuous heating to quickly heat the silicon rods to a specified temperature range
High efficiency and safety
