Wet Chain Equipment


Removes surface PSG/BSG after the diffusionprocess and polishes the wafer surface.

High‑efficiency cleaning, energy‑saving and environmentally friendly


Removes surface PSG/BSG after the diffusionprocess and polishes the wafer surface.
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Product Features

 

 

Constant pressure drip dispensing for high reliability.

Precise chemicalreplenishment

adoptsPFA high-precisionmagnetostrictivereplenishment system.

Smooth transmission

transmission system isdivided into two inde-pendent groups, rollersuse PVDF material withhigh acid/alkali resis-tance while main trans-mission featureswater-lubricated rollertechnology.

High-efficiency circula-tion

equipped withhigh-efficiency circula-tion pumps, ensuringbalanced chemicalconcentration/tempera-ture in main and auxilia-rytanks.

High-efficiency drying

equipped with four setsof air knives with slot airoutlets for dead-angle-free surface drying,featuring filters toensure drying chambercleanliness.

 

Technical Specifications

Product Capacity Dual 6-track capacity >17,000 PCS/h (182mm)
Dual 6-track capacity >12,500 PCS/h (210mm)
Breakage rate ≤0.01%
Uptime≥98%
Speed:1-5 m/min adjustable

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