Wet Method Tank Equipment


Primarily used for texture etching, cleaning andpre-/post-gettering wet processing wafers usedfor monocrystalline silicon solar cell, removing thecutting damage layer and surface contamination.

High‑efficiency cleaning, energy‑saving and environmentally friendly


Primarily used for texture etching, cleaning andpre-/post-gettering wet processing wafers usedfor monocrystalline silicon solar cell, removing thecutting damage layer and surface contamination.
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Product Features

 

Imported PLC control

imported PLC controlsteadily increasesequipment capacity.

Robot arm

robot armdesign featuresincreased height andinertia disk design,effectively avoidingpost-crushing failures;features a newly inno-vated inclined basketlifting structure.

Metal-free process

compatible with metal-free process equipment,meeting various newtechnology cell manu-facturing processes .

High-efficiency drying

simulated airflow testing,rationally arranged airduct guidance design.

Full-feature customiza-tion

overseas models available to meet UL certification require-ments.

Customizable for various wet process steps

Suitable for texturingprocesses in PERC/TOP-Con/HJT/BCand other technologies.

 

Technical Specifications

Theoretical Capacity ≥18,000 pcs/h (6 baskets, 182); 
>15,000 pcs/h (6 baskets, 210);
Fragment rate ≤ 0.01%
Uptime>98%
>18,000 PCS/h (@6 cassette/batch @ 182mm wafer)
>15,000 PCS/h (@ 6 cassette/batch @ 210mm wafer)
Wafer breakage rates s0.01%
Uptime≥98%

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