Wafer Singulator-cleaner


Performs wafer singulation and insertion completing the processes of wafer singulation, wafer insertion into cassettes, cleaning and drying, replacing traditional manual operations.

Efficient sharding, intelligent monitoring


Performs wafer singulation and insertion completing the processes of wafer singulation, wafer insertion into cassettes, cleaning and drying, replacing traditional manual operations.
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Product Features

 

High-efficiency wafersingulation

equippedwith patented technolo-gies such as waterabsorption plates,cassette positioning,slow lift and dryingtanks, achieving efficientwafer singulating andlow breakage rate.

Fully automatic wafersingulation

newlydesigned horizon-tal/vertical singulatingmechanical structureensures stable opera-tion, fully automaticprocess with no manualintervention.

Intelligent monitoring

adopts Keyence buscommunication systemand absolute value busservo, enabling rapidcapture and processingof production data forintelligent monitoring.

Multi-functional customi-zation

customizable3-head/4-head wafersingulating; horizon-tal/verticalwafer singu-lating and other custom-ized functions.

Fast changeover

supports various wafersizes, with changeovertime not exceeding 4hours between different sizes.

 

Technical Specifications

Fully automatic chip-insertion and cleaning integrated machine
Category Wafer Size Specifications
Theoretical Capacity 182mm Full Wafer
210mm Full Wafer
≧16000pcs/h 
≧14000pcs/h
Wafer Thickness 182mm Full Wafer
210mm Full Wafer
Thickness 110-200um
Thickness 110-200um
Chipping Rate 182mm Full Wafer
210mm Full Wafer
≦0.5% 
≦0.5%
Breakage Rate 182mm Full Wafer
210mm Full Wafer
≦0.1% 
≦0.1%
Drying Rate 182mm Full Wafer
210mm Full Wafer
100%
100%
Compatibility 166/182/210/220/230/240  

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