Wafer Degluer


Used for the degluing process after wafer slicing, separating wafers from the substrate by softening the adhesive with high temperature.

High‑efficiency cleaning, energy‑saving and environmentally friendly


Used for the degluing process after wafer slicing, separating wafers from the substrate by softening the adhesive with high temperature.
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Product Features

 

Automation process

usessingle-arm robot for conov-eying, supporting automaticacid solution preparation,heating and secondarydegluing process, reducingmanual intervention.

High-efficiency cleaning

equipped with multi-tankspray rinsing and ultrasoniccleaning units, combined within-line heating, improvingdegluing efficiency.

Energy saving and environ-mental protection

dirtywater is filtered and recy-cled for reuse, reducingwater consumption; acidexhaust extraction deviceminimizes environmentalpollution; the equipmentfeatures a separate lacticacid recovery function .

Rich configuration options

automatic edge removal,automatic wing weighing,automatic palletizing ofcrystal holders, automaticdischarge of crystal holders, etc.

 

Technical Specifications

Main Features Debinding of the sliced wafers
Process Control Automatic control realized through PLC of famous brand.
Equipment is running and operated automatically.
UPTIME 98% (24h/day, over 353 working days per year)
Production Schedule Three-shift system (Note: 23 hours per day, 330 days per year)
Capacity ≥205 cuts/day
Cycle Time ≤6.7 min/board (user-defined, adjustable)
Applicable Brick Compatible with various crystal holders for 4" to 8"
Applicable Dimensions Tank dimensions: accommodate 1000mm brick (including iron plate andaluminum tail seat) for in-tank operation

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