LQQP2060/3060
Semiconductor Silicon Slicer
This product is a special equipment for cutting semiconductor monocrystalline silicon wafers using diamond wire, which can process 8-inch and 12-inch silicon ingots, with maximum length of 450mm (crystal orientation deviation angle ≤1°).
High stability
This product is a special equipment for cutting semiconductor monocrystalline silicon wafers using diamond wire, which can process 8-inch and 12-inch silicon ingots, with maximum length of 450mm (crystal orientation deviation angle ≤1°).
Product Features
Low silicon material loss
Good processing quality
High cutting efficiency
Good stability
Technical Parameters
| Specification of silicon ingot | 8 inch / 12 inch |
| Length of silicon ingot | ≤450mm |
| Maximum line speed | 30m/s |
| Wire busbar diameter | ≥Φ0.05mm |
| TTV | ≤10 μ m (ADE7200) |
| BOW | ≤±10 μ m (ADE7200) |
| Warp Average | ＜12 μ m |
| Yield | ≥97% |
| Breakage Rate | ≤1% (except for non-equipment factors) |
| Equipment Dimension | 4460×2360×3390mm |
| Total Rated Power | 188kW |
| Equipment Weight | 15.6t |
Related Products
Dalian Base: No. 40 Yingri Road, Ganjingzi District, Dalian, Liaoning Province
Wuxi Base: No. 15 Jinghong Road, Xishan District, Wuxi, Jiangsu Province
Tel: +86-510-68088419
Stock Code
920368
Dalian Base: No. 40 Yingri Road, Ganjingzi District, Dalian, Liaoning Province
Wuxi Base: No. 15 Jinghong Road, Xishan District, Wuxi, Jiangsu Province
Tel: +86-510-68088419
Stock Code
920368
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