02-02-01

Diamond wire cropper LQJD33250P


Equipment advantages
1、The ingot is automatically fed by the truss manipulator, equipped with safety protection net and safety grating;
2、The cutting head adopts the gantry double column structure, the structure is stable and reliable, the failure rate is low, the cutting efficiency is high, the precision is high;
3、The cut ingot is automatically returned to the cutting area, which is convenient for handling. Customers can choose automatic cutting device;


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Main technical indicators

Processing specifications: 8 inches/12 inches

Processing length: 2500mm

Sample thickness: ≥1.3mm

Processing roughness: Ra<3μm

Diamond wire diameter: 0.50/0.65mm

Cutting flatness: ≤0.2mm

Running line speed: 1800m/min

Equipment length, width and height: 4500*3860*3600mm

Total equipment power: 9.5kW

Total equipment mass: 9t

Equipment advantages

1. The ingot is automatically fed by the truss manipulator, equipped with safety protection net and safety grating;

2. The cutting head adopts the gantry double column structure, the structure is stable and reliable, the failure rate is low, the cutting efficiency is high, the precision is high;

3. The cut ingot is automatically returned to the cutting area, which is convenient for handling. Customers can choose automatic cutting device;

4. The feeding conveyor and cutting head are equipped with wireless operating handles for easy operation of left and right up and down movement, and convenient replacement of loops and cutting wheels;

5. Optional work order scanning and laser coding functions;

6. Optional robot automatic sample device;

Processing process

1. Silicon rod loading

The loading cart is manually pushed to the loading station of the manipulator, and the code is scanned. The manipulator transports the silicon rod to the feeding table of the cutting machine;

2. Worktable transportation

The equipment feeds and transports according to the set cutting length. The feeding platform moves the silicon rod to the processing position for processing;

3. Cutting processing

The gantry cutting head performs head and tail cutting and cutting of different lengths;

4. BLOCK unloading

The BLOCK is automatically pushed to the unloading station, and after length measurement and laser coding, the robot grabs it to the unloading car;

5. Sample processing

The equipment is equipped with a patented robot suction cup structure to automatically take samples. The samples are automatically dried and laser coded and sent to the splicing box;

6. Cycle

Repeat the previous 2-3-4-5 cutting and sampling work.

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