01-03-01

Wet chemical texturing equipment


Product function
1.Removing the damaged layer and surface dirt during wiresawing
2.Using strong alkali to etch the crystalline silicon surface to form a regular pyramidal suede, Increasing the absorption of sunlight and reduce the reflectivity of the silicon wafer
3.Increasing the surface area of the silicon wafer, then the PN junction area also increases accordingly


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Project Parameter
Function 1. Remove the cutting damage layer and surface dirt
2. Use strong alkali to corrode the surface of crystalline silicon to form a regular pyramid-shaped velvet surface, increase the silicon wafer's absorption of sunlight, and reduce the reflectivity
3. Increase the surface area of ​​the silicon wafer, and then the PN junction area will also increase accordingly
Advantages ≥16000PCS/H (6 baskets 182);≥12000PCS/H (4 baskets 182),
≥13500PCS/H (6 baskets 210);≥10000PCS/H (4 baskets 210)
Fragmentation rate ≤0.01%, Uptime ≥98%. Imported PLC control steadily improves the production capacity of the equipment.
The mechanical arm slow lifting method is adopted, and the equipment meets the dry and wet separation, matching the development trend of high-efficiency batteries.
The process tank adopts the classic internal and external tank circulation mode, which can quickly and effectively stir the newly added medicine and additives evenly, and the temperature control accuracy error in the tank is <±1℃.

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