02-03-01

Semi-conduct Slicer LQQP2060/3060


Equipment advantages
1、It's tension sensor measuring range of 30N control accuracy is higher.
2、The auxiliary slurry pipe has patented technology, and the main and secondary flow rates are controllable separately;
3、Low inertia lightweight integrated wheel, easy to replace the assembly structure


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Main technical indicators

Processing silicon material specifications: 8 inches/12 inches

Processing silicon material length: ≤450mm

Maximum line speed: 30m/s

Steel wire busbar diameter: ≥medium 0.05mm

TTV: ≤10μm (ADE7200)

Bow: ≤±10μm (ADE7200)

Warp average value: <12μm

Finished product rate: ≥97%

Wire breakage rate: ≤1% (excluding non-equipment factors)

Equipment dimensions: 4460×2360×3390mm

Rated total power of equipment: 188kW

Equipment deadweight: 15.6t

Equipment advantages

1. It's tension sensor measuring range of 30N control accuracy is higher.

2. The auxiliary slurry pipe has patented technology, and the main and secondary flow rates are controllable separately;

3. Low inertia lightweight integrated wheel, easy to replace the assembly structure

4. The system uses Siemens motion control system and motor imported from Germany;

5. The surface quality of silicon wafers, TTV, line marks, warping and other indicators are well controlled;

6. It is compatible with the crystal tray of the automatic stick sticking equipment, and the bottom surface adopts NTC form;

7. The equipment is designed and manufactured for semiconductor wafer processing, not a photovoltaic transformation machine;

8. The front-end loading method is easy to operate and has the conditions for upgrading to automatic loading;

9. Zhang The arm weight and suspension length are small, and the line arrangement angle is close to 90°, which is conducive to line arrangement control;

10. The vertical feed adopts a casting with a 4-rail mechanism to reduce the TTV of the knife-entry slice;

11. The wire-retracting and wire-releasing system is located on both sides of the equipment and is installed on an integrated casting base with a stable structure;

12. The spindle adopts an angular contact bearing and oil-gas lubrication structure, and cooling adopts a separate water tank for water supply;

13. The equipment base, spindle box support, wire arrangement, and wire-retracting and wire-releasing support are all integrated casting structures;

 

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