LQQP2030P

SIC Slicer


This product is a special processing equipment for cutting SIC wafers using diamond wire, and can process 6-inch and 8-inch wafers , with a maximum processing length of 300mm.

Accurate software control


This product is a special processing equipment for cutting SIC wafers using diamond wire, and can process 6-inch and 8-inch wafers , with a maximum processing length of 300mm.
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Product Features

 

Small material loss and good quality

With small material loss, good processing quality, high cutting efficiency, good stability.

One-piece casting stability

Machine base, spindle box seat, vertical feed column, feed slide are stable one-piece casting structure.

High precision bearings

The spindle adopts imported NSK bearings, and the structure of the axle box is independently researched, developed and assembled, with a precision higher than the industry standard.

Stable Siemens system

Siemens motion control system and motors are adopted to ensure stable operation for a long time.

Oscillating cutting uniformity

The fixture adopts oscillating mechanism to ensure that the workpiece is oscillating cutting during machining and the cutting force is uniform.

Independent cooling anti-condensation

Spindle cooling adopts independent water tank, realising large flow control mode, solving the problem of condensation inside the shaft box.

Convenient automation operation

The automation supporting design can realise one-click material lifting and one-click automatic wire aligment.

Excellent control of indicators

TTV, WARP, BOW, surface line marks, chipping, breakage rate.

Accurate positioning

The crystal tray adopts the patented T-shaped slot positioning to ensure the accuracy of processing crystal direction.

Accurate software control

Patented software control system, accurate tension control.

 


Technical Parameters


Maximum workpiece size 4“~6”×LMax300mm
Line operation mode Bi-directional feed line
Maximum line speed 2100m/min
Spindle spacing 375mm
Number of main rollers 2 rollers
Outer diameter of main rollers Φ193mm
Wire used 0.23mm~0.25mm
Cutting tension 10~50N
Cutting method Undercutting
Fast forward, fast reverse 10~60mm/min
Maximum swing angle ±12°
Maximum swing speed 12°/s
Maximum wire storage capacity 50 (0.25 plated diamond wire) Km
Equipment dimension (LxWxH) 405×1800×3100mm
Equipment weight Approx. 13000Kg
Main roll weight Approx. 140/pc (net weight)Kg

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