Ultra-high precision
Product Features
High line speed cutting
High line cutting speed of 30m/s, high cutting efficiency, high output ratio.
Multiple processing modes
Three processing modes,rotary, line swing and material swing.
Ultra-high precision
The TTV of the cut-off sample wafer is within 30μm.
Fine wire control
Stably use 0.18mm diamond wire, precise tension control, and excellent control of material loss.
Advanced controller
Uses the highest level of Huichuan IS810 series controller, equipped with 13 high-precision servo motors.
Vibration-damping design
The take-up and pay-off system is arranged on the left and right sides of the equipment, which effectively reduces the impact of vibration and greatly improves the processing accuracy.
Technical Parameters
| Size range of SiC ingot | Φ4~12 inch / 100mm |
| Average cutting speed | 0.3mm/min |
| Cutting process setting steps | ≥30 steps |
| Wire tension | 0~110N (45N for 0.25um wire ) |
| Wire Speed | 0~30m/s |
| Diamond Wire Diameter | ≥0.18mm |
| Wafer TTV | ≤30μm |
| Equipment weight | 5.5t |
| Tank volume | 110L |
| Machine dimensions (L x W x H) | 2370x2256x2080mm |
| Total Power | 50kW |
| Cutting Breakage Rate | ≤1% (except for human reasons, SiC material, wire, maintenance, etc.) |
Related Products
Dalian Base: No. 30, Huantai West Street, Yingchengzi Industrial Park, Ganjingzi District, Dalian City
Wuxi Base: No. 15 Jinghong Road, Xishan District, Wuxi, Jiangsu Province
Tel: +86-510-68088419
Stock Code
920368
Dalian Base: No. 40 Yingri Road, Ganjingzi District, Dalian, Liaoning Province
Wuxi Base: No. 15 Jinghong Road, Xishan District, Wuxi, Jiangsu Province
Tel: +86-510-68088419
Stock Code
920368
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