QPL950+

DW slicer


Used for cutting solar wafer

Multi-Functionality


Used for cutting solar wafer
+
  • 001(1745818909571).png
  • 002(1745818915394).png

Product Features

 

Adjustable wheelbase

Horizontal & vertical wheelbase is minimum and adjustable.

Multi-speed selection

Up to 19 options, adjustable wheelbase range 310-410mm.

Compatible with all specifications

Compatible with half-wafer, reguler-size wafer and rectangular wafer.

Multi-Functionality

Front/middle/back-end automation loading and unloading.

 


Technical Parameters


Maximum length of processed rods 1000mm x 1PCS
Specification of processed silicon rods 182&210 half sheet ~230 full sheet
Cutting structure Three-axis structure (6 axes + 3 rollers + 3 high power motors and drives)
Wire speed Max45m/s
Adjustable axis distance 280~410mm
Main roll length 1060mm
Diameter of main roll 3-Maxφ160mm
Spindle box lubrication method Grease Lubrication
Electrical system Huichuan customised system (recommended) & Siemens system + third party motors
Automatic loading form Central loading and unloading
Mortar box volume Max800 L (mortar box side mounted)
Machine floor space 5200mm2100mm3350mm

Related Products

Copyright©2024 Dalian Linton NC Machine Co., Ltd.

SEO