QP1200

Half wafer DW slicer


Used for cutting solar wafer

Compatibility


Used for cutting solar wafer
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Product Features

 

Adjustable axis distance

Horizontal & vertical axis distance is minimum and adjustable.

Compatibility

Half-wafer or customised full-size wafer compatibility up to 19 options, adjustable wheelbase range 310-410mm.

Long bar cutting

Maximum bar length of 1200mm.

Multi-Functionality

Front/middle/back-end automation loading and unloading.

 


Technical Parameters


Length of processed silicon rods 1200mm x 1PCS
Specification of processed silicon rods 182&210 half sheet (can be customised 182&210 half sheet ~230 whole sheet fully compatible specialised machine)
Line speed 45m/s (standard)
Cutting structure 3-axis structure (6 axes + 3 rollers + 3 high power motors and drives)
Adjustable axis distance 280/300mm 2-speed adjustable, 3rd axis axis distance adjustable
Main roller length 1260mm
Electrical system Huichuan customised system or Siemens system
Mortar box volume 1000L or according to customer's requirement
Spindle box lubrication method Oil-air lubrication

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