QDHA35100

Single wire cropper


The single loop wire cut-off machine is the equipment to cut and process the monocrystalline silicon ingots through the high-speed unidirectional operation of the diamond wire, which can process different specifications of the silicon ingots, remove the head and tail, take the sample pieces and cutting rework (round rods/square bars).

High efficiency and stability


The single loop wire cut-off machine is the equipment to cut and process the monocrystalline silicon ingots through the high-speed unidirectional operation of the diamond wire
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  • QDHA35100单刀头环线反切截断机.png

Product Features

 

Automatic cutting

Load the workpiece by servo loading table, and achieve cutting rework automation.

High efficiency and stability

Optional dual-line dual-servo tension configuration to achieve one-time cutting of samples.

Algorithm update

Optimise tension control and feeding process to improve the quality of finished products.

Superior quality

High cutting efficiency, good cutting surface quality, small kerf, low material loss and easy operation.

 

 

Technical Parameters


Bar diameter Ø240~350mm
Bar length 2-980mm
Cutting speed ≥50mm/min
Line speed 0~50m/s
Ring wire diameter 0.42~0.65mm
Cutting time ≤6min
Machine external dimensions (mainframe) 3100*1900*2700mm
Rated total power 5kW
Equipment weight 3t

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