QP950

Advanced N-Type Super Thin Wafer Slicer


Used for cutting solar wafer

Large loads


Used for cutting solar wafer
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Product Features

 

Large loads

High line movement speed

Low wire consumption

Ultra-fine wire

Ultra-thin wafer

Full size compatibility

User Friendly

 


Technical Parameters


Length of processed silicon rods Standard length 950mm (maximum length 1000mm)
Specification of processed silicon rods Fully compatible with 182 & 210 half sheets to 230 full sheets
Number of main rollers 3
Line speed of steel wire Mass production line speed 45m/s (maximum supported line speed 50m/s)
Horizontal adjustable axis distance 280~400mm
Vertical adjustable axis distance 220~270mm
Main roll specification 3*1060mm (150mm diameter after coating)
Spindle box lubrication method Oil-air lubrication (grease lubrication is optional)
Electrical system Huichuan customised system (main configuration) & Siemens system
Automatic loading form Front/rear loading/unloading
Mortar box volume Max 800 L (centre layout, side pull-out)
Main machine size 4700mm*2100mm*3350mm

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