QDHD35770/QDHD35790

Multiple wire cropper


Used in the Truncation section of the silicon ingot manufacturing process

Automatic docking


Used in the Truncation section of the silicon ingot manufacturing process
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Product Features

 

Large capacity and high quality

Large capacity, less chipping, good end verticality, easy maintenance and adaptable to N-type wafer inspection.

Automatic docking

AGV loading, no need for truss manipulator.

Reduce labour

Optional automatic rotation and automatic wire alignment, reduce labour.

 


Technical Parameters


Processing silicon rod gauge length Max7500mm
Specification of processed silicon rods φ230-φ350mm
Number of rods processed at the same time 1 root(able to join bars together)
Tension Control 0-120N
Ring wire diameter 0.38~0.5mm
Wire speed 0~40m/s
Equipment size 19500x3100x3200mm(Including loading and unloading roller conveyor)

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