LT-GMS2510

Grinder


It is used for grinding, polishing and chamfering of silicon ingots. It is an equipment to polish the arc and face of different sizes of monocrystalline silicon square ingots after squaring, with the functions of rough grinding, fine grinding, R-arc and chamfering at the same time, and it can be used as an independent processing equipment, or used as a grinding unit in the factory's automated production line at the same time.

High-efficiency grinding


It is used for grinding, polishing and chamfering of silicon ingots. It is an equipment to polish the arc and face of different sizes of monocrystalline silicon square ingots after squaring
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Product Features

 

Intelligent positioning

Automatic loading and centring, intelligent positioning of the workpiece, improving the compatibility of abnormal bars.

Automatic detection

Automatic detection of the margin, intelligent matching of the depth of cut, improve machining efficiency.

Precise supply

Automatic detection of tool consumption, intelligent supply loss, improve the accuracy of finished products.

High-efficiency grinding

Automatic five-dimensional correctable loading table, which can meet the minimum 0.1mm margin grinding on one side.

 


Technical Parameters


Side distance of processed bars 166-235mm
Bar length 100-950mm
Processing efficiency ≤32min/root (M10/830mm)
Dimensional accuracy ≤±0.03mm
Roughness Ra≤0.1μm
Grinding wheel specification 250-320mm(compatibility)
Machine external dimensions (spindle) 5410×2960×2400mm
Rated total power 61kW
Machine weight 12t

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