Single loop-wire re-cropper QDHA35100
Features
1、Leading concept, achieving automation of re-cropping process through servo feeding platform docking with work pieces
2、Efficient and stable, optional dual wire dual servo tension configuration, achieving one-time sampling
3、Algorithm updates to optimize tension control, feed processes and improve finished product quality
Wet chemical texturing equipment
Product function
1.Removing the damaged layer and surface dirt during wiresawing
2.Using strong alkali to etch the crystalline silicon surface to form a regular pyramidal suede, Increasing the absorption of sunlight and reduce the reflectivity of the silicon wafer
3.Increasing the surface area of the silicon wafer, then the PN junction area also increases accordingly
Automatic CNC Grinder LQGM2060/3060
Main technical specification
Processing ingot diameter :6-8 "/12"
Processing ingot length :600mm/450mm
Ovality :≤0.06mm
Diamond wire cropper LQJD33250P
Equipment advantages
1、The ingot is automatically fed by the truss manipulator, equipped with safety protection net and safety grating;
2、The cutting head adopts the gantry double column structure, the structure is stable and reliable, the failure rate is low, the cutting efficiency is high, the precision is high;
3、The cut ingot is automatically returned to the cutting area, which is convenient for handling. Customers can choose automatic cutting device;
CCZ side feeding equipment
Single blade circular cutting machine QDHA35100
Fully automatic degumming machine
Fully automatic insert cleaning machine
Semi-conduct Slicer LQQP2060/3060
Equipment advantages
1、It's tension sensor measuring range of 30N control accuracy is higher.
2、The auxiliary slurry pipe has patented technology, and the main and secondary flow rates are controllable separately;
3、Low inertia lightweight integrated wheel, easy to replace the assembly structure
Crystal Grower KX360MCZ
Design Advantages
1、Application field: mild doped, magnetic control;
2、In the occurrence of abnormal crystal pulling processes such as loss of structure and silicon material recharging, the corresponding automatic process can be selected from the system to run;
3、Equipped with the international leading brand magnetic field, the central field strength can reach 4000GAUSS, and the magnetic field distribution is uniform, which is conducive to the growth of high-quality semiconductor crystals
Continuous charging czochralski single crystal furnace
Main technical specification
1. Machine size: (LWH) 2000×2300×10800m;
2. The inner diameter of the main chamber is 1400mm, and the inner diameter of the auxiliary furnace is 350mm; compatible with 24~34 inch RCz and 32~34 inch CCz thermal fields, and can pull crystals with a diameter of less than 10 inches;
3. Heating method: resistance heating, DC power supply Pmax=150:50Kw, frequency 50Hz;
DW squarer LQKF2375
equipment advantages
1、The rotary table is arranged with two brick holder devices to realize the separation of processing station and loading/unloading station through the rotary table rotation.
2、the main support of the cutting head adopts high rigidity structure, equipped with two main motor drive, greatly improving the stability of processing.
3、Column sliding table adopts servo drive to realize up and down movement, guide wheel bracket with good rigidity, firm and reliable, reduce the risk of wire breakage.
Dual loop-wire cropper QDHZ35850
Features
1、Unique mode achieving automation of head and tail cutting and auto sampling
2、High speed and efficiency, complete all processes in one cutting, with a unit production of ≥ 6GW
3、Automatic centering, combined with multiple auxiliary supports, improves surface verticality and reduces chipping
Dual station cropper QDHS35850
Features
1、Innovative concept, single wire dual workstations, cutting and unloading at the same time, improving automation turnover rate
2、Pre-detection, increasing fixed length segment ratio, with a unit production of ≥ 3GW
3、Back-end loading, equipped with high-precision detection mechanism, with a length error of ≤ 0.2mm
Quad loop-wire squarer QHFA2395
Features
1、Capable of achieving ultra-high unit production capacity of 1GW
2、Equipped with a rotary workbench, with a preparing time of ≤ 30 seconds
3、Simultaneous cutting of four loop-wires, combined with tension control algorithm, with a range error of ≤ 0.15mm
Grinding / chamfering machine LT-GMS2510
Features
1、Automatic loading and centering, intelligent positioning of the work piece and improved compatibility with abnormal ingots.
2、Automatic detection of the margin, intelligent matching of the depth of grinding, improve machining efficiency ≤ 30s
3、Automatic detection of tool wear, intelligent replenishment of wear, and improvement of finished product accuracy
4、Automatic five dimensional correctable feeding table, capable of meeting the minimum unilateral 0.1mm allowance grinding
Slicer QP950
Features
1、Minimum and adjustable horizontal and vertical shaft distance
2、Up to 19 positions available, adjustable shaft distance 310-410mm
3、Fully compatibility with half wafers, full wafers and rectangular wafers
4、Meets the automation requirements of loading and unloading from the front, middle, and back ends
Half wafer slicer QP1200
Features
1、Minimum and adjustable horizontal and vertical shaft distance
2、Half wafer or full wafer spec compatible and up to 19 positions available, adjustable shaft distance 310-410mm
3、Maximum compatible brick length up to 1200mm
4、Meets the automation requirements of loading and unloading from the front, middle, and back ends
Half brick grinding / chamfering machine
Features
1、Fully automatic integrated machine, single station squaring + dual station surface grinding + four station chamfering, comprehensively improving processing efficiency
2、Full detection of work piece length, width, and height, accurate squaring positioning, loop-wire + servo tension mode, improving range error and reducing silicon loss
3、Adoption of roughing and finishing nested type electric spindle, together with the detection and compensation system, to ensure the dimensional accuracy of finished products
4、High unit production capacity, compatible with half brick processing, lower investment and higher output.
KX380PV
It can be compatible with up to 40 inches hotzone, to meet the growth needs of more silicon inputing and larger specifications of ingot, and it reserves a variety of upgradable modules, and the technology upgrade is cost-effective.
KX380PV-MCZ
It can meet the needs of low oxygen crystal pulling, higher MCLT requirement and our multi-configuration optional can provide customers more space of model choices.
KX420PV
It can be compatible with up to 42inches hotzone, to meet the growth needs of more silicon inputing and larger specifications of ingot, and it reserves a variety of upgradable modules, and the technology upgrade is cost-effective.
KX460PV
It can be compatible with up to 42inches hotzone, to meet the growth needs of more silicon inputing and larger specifications of ingot, and it reserves a variety of upgradable modules, and the technology upgrade is cost-effective.
Wet etching equipment
Product function
Removing back PSG and polishing
Wet chemical texturing equipment
Product function
1.Using strong alkali to polish the back of the silicon wafer to form a suede structure similar to a mirror surface to improve wafer's absorption of long wave
2.Increasing the thickness uniformity of the back passivation film
3.Reducing surface area of the back, improving MCLT, and reducing the back recombination rate
RCA Trough cleaning equipment
Product function
1.Removing PSG
2.Removing polycrystalline silicon deposits from the front (LPCVD)PECVD wound coating, and removing the remaining BSG on the surface
Wet chemical texturing equipment
Product function
1.Removing the damaged layer and surface dirt during wiresawing
2.Using strong alkali to etch the crystalline silicon surface to form a regular pyramidal suede, Increasing the absorption of sunlight and reduce the reflectivity of the silicon wafer
3.Increasing the surface area of the silicon wafer, then the PN junction area also increases accordingly
Back polishing and cleaning equipment
Product function
Polishing the wafer
Chemical texturing and cleaning equipment
Product function
The front suede surface of the wafer is generated, and the back area will open
Automatic degumming machine
Product function
Degumming the wafer after slicing
Automatic silicon cleaner
Product function
Main functions: With HF+HNO3 mixed acid corrosion cleaning and reagent (weak acid) soaking, cleaning function
Fully automatic wafer degummer&singulator&cleaner
Equipped with absorbent plate, cassette positioning, slow lifting, drying tank and other patented technology, which can separate wafers efficiently and reduce the broken rate
Japanese Keentu bus communication system and absolute bus servo are adopted, whcih can quickly grasp the processing of production data and achieve intelligent monitoring，which is compatible with various specifications of silicon chip sizes and switching time between different sizes does not exceed 4 hours
Fully automatic wafer degummer&singulator&cleaner
Whole cutter feeding，continuous wafer loading and inserting to improve the production capacity. In addition, through the improvement of the mechanism, the basket changing time is minimized, so that the production capacity of the whole machine is released to the best
Wafer degumming, inserting and cleaing integrated and are automatic, whcih can reduce the turnover link; loading fully automatic, one operator can handle several machines, which can save manpower
Crystal Grower KX320-600
Design Advantages
1、The world's first single crystal furnace for growing 24 inch crystals
2、The world's first single crystal furnace for growing 24 inch crystals;
3、Magnetic field lifting mechanism installation space can be reserved
CNC Roller Mill LQ003PF
Main technical specification
1. Processing crystal rod diameter: 4~8 inches
2. Processing crystal rod length: ≤400mm
3. Ovality: ≤0.05mm
CNC surface grinder LQ016/LQ018
equipment advantages
The main components are all of well-known brands, high stability and durability.
The precision P3 ball screw drive is adopted, with high precision.
The castings are made of high grade gray cast iron, which has better bending and torsional stress resistance.
Optional three-stage filtration tank or paper belt filter to keep the cutting fluid clean, improve machining performance and tool life, and reduce environmental pollution.
The hard rail is scraped and polished by hand, and the guide rail joint surface is plastic-coated to reduce the damping coefficient and improve the machine tool precision.
Optional conventional, intensive and integrated electromagnetic chucks, strong versatility.
SiC induction grower
Design advantages
1、Meet 6 "/8" crystal growth;
2、One-button intelligent start, reduce manual intervention, conducive to large-scale production.
3、PVT-MF-50 silicon carbide induction grower is suitable for growing high-quality six inch silicon carbide single crystal, high purity silicon carbide raw material synthesis, crystal annealing and other fields.
SiC resistance heating crystal grower
Design advantages
1、Compact structure, side-by-side layout can be used to improve the utilization rate of the plant.
2、Satisfy 6-8 inch semi-insulating/conducting crystal growth needs.
3、PVT-RS-40 silicon carbide resistance heating crystal grower is suitable for growing high-quality 6-8 inch silicon carbide single crystal, high purity silicon carbide raw material synthesis, crystal annealing and other fields.
SiC tube synthetic furnace
Design advantages
1、It fills the equipment gap specially used for synthetic raw materials in the market and improves the efficiency of raw material synthesis.
2、One-button intelligent start, reduce manual intervention, conducive to large-scale production.
3、Compact three-dimensional machine design, convenient layout, improve the utilization rate of the plant.
SiC cropper LQJD3010
Design advantages
1、The equipment can apply 30m/s high wire speed for stable cutting, with high cutting efficiency and high output ratio;
2、The equipment can choose the processing method of rotation, wire swing or material swing by itself to better achieve the various requirements of the process;
3、The processing precision of the equipment is high, and the average TTV of the truncated sample is ≤30μm,exceeding the average level of industry;
4、The equipment can use 0.18mm diamond wire stably,with accurate tension control and excellent fine wire control on material loss;
5、The equipment uses the highest level IS810 series controller of Inovance, and is equipped with 13 high-precision servo motors;
6、The take-up and pay-off systems are arranged on the left and right sides of the machine, which effectively reduces the impact of vibration and greatly improves the machining accuracy.
Anneal furnace VAF600
Design advantages
1、Equipment structure is compact;
2、Adopting ring heating structure, the temperature uniformity of the furnace body is good.
3、Automatically adjusting the temperature.
4、Precise vacuum control.
5、the product is compatible with a wide range of products,changing the vehicle according to the size of the product makes it easy to change the model.
DW slicer LQQP1570/2038
equipment advantages
1、Machine base and spindle box support, vertical feed column, feed slide are all one-piece casting structure, suitable for high-precision, high-linear speed cutting.
2、the equipment take-up and payoff motors and spindle motors are Siemens brand, to ensure that the equipment for a long time running temperature stability, to meet the processing accuracy requirements.
3、The fixture adopts a swinging mechanism to ensure that the workpiece is cut in a swinging manner during machining and the cutting force is uniform.
4、the use of Siemens motion control system and the original motor, wire breakage rate is very low.
5、The processing surface TTV, Warp, Bow, surface line marks, edge collapse, additional cutting and wire breakage are well controlled.
Kyropoulos Crystal Grower
equipment advantages
1、shorter growth cycle, lower energy consumption, and the rate of timber extraction is significantly improved.
2、Loading weight 125 ± 25kg;
3、Optional hot zone and growth process.
CNC surface grinder LQ016/LQ018
equipment advantages
The main components are all of well-known brands,have high stability and durability.
The precision P3 ball screw drive is adopted, with high precision.
The castings are made of high grade gray cast iron, which has better bending and torsional stress resistance.
Optional three-stage filtration tank or paper belt filter to keep the cutting fluid clean, improve machining performance and tool lifetime, and reduce environmental pollution.
The hard rails are all manually scraped and polished, and the guide rail joint surface is plastic-coated to reduce the damping coefficient and improve the machine tool accuracy.
Optional conventional, intensive and integrated electromagnetic chucks are available, with strong versatility.
Microwave heating and water quenching roller crushing line
Equipment configuration
This equipment use microwave heating and water quenching to achieve continuous production, reduce pollution, reduce the purpose of silicon loss.
After microwave heating and water quenching, the polysilicon raw material will be more convenient to be loaded into the furnace, the crystal block is heated evenly, and it is easier to melt.
Brick aotomatic microwaving heating line
Specification of the equipment
It is used in the siliocn brick gluing process
We use microwave continuous heating to quickly heat the silicon rods to a specified temperature range
High efficiency and safety
Silicon chunk cleaner
Surface cleaning and treatment of solar grade silicon materials, removing solid particles, organics, metal ions and other pollutants and natural oxide film attached to the surface.
Microwave Heating & Water Quenching System
Function: Use physical methods to change the physical structure of silicon materials to make them more fragile.
Principle: Microwave heating followed by pure water quenching is used to change the physical structure of silicon material.
PV mono silicon ingot grower
Compatible with up to 40-inch hot zone to meet the needs of larger feeding volume and larger size monocrystalline silicon ingots growth.
Single wire cropper
The single loop wire cut-off machine is the equipment to cut and process the monocrystalline silicon ingots through the high-speed unidirectional operation of the diamond wire, which can process different specifications of the silicon ingots, remove the head and tail, take the sample pieces and cutting rework (round rods/square bars).
Double wire cropper
It can process different specifications of the silicon ingots and round ingots, remove the head and tail, take the sample pieces and cutting rework.
Double channel cropper
Duplex cut-off machine has two processing stations for the cut-off of silicon ingots and round ingots with fixed or non-fixed length.
Cropping cluster
Truncation automation production lines
Multiple wire cropper
Used in the Truncation section of the silicon ingot manufacturing process
Loop wire squarer
The loop wire squarer uses a high speed and reciprocating diamond wire to process silicon ingot. which equipped with interchangeable dual-station workbench, loading and unloading silicon ingot through robot and visual positioning.
Advanced N-Type Super Thin Wafer Slicer
Used for cutting solar wafer
12-inch Czochralski Single Crystal Growing Furnace with Superconducting Magnetic Field
For 12-inch semiconductor grade silicon ingot growth
Czochralski Crystal Growing Furnace for Semiconductor Silicon Parts
For 24-inch semiconductor grade silicon ingot growth
