Single loop-wire re-cropper QDHA35100
Features
1、Leading concept, achieving automation of re-cropping process through servo feeding platform docking with work pieces
2、Efficient and stable, optional dual wire dual servo tension configuration, achieving one-time sampling
3、Algorithm updates to optimize tension control, feed processes and improve finished product quality
Dual loop-wire cropper QDHZ35850
Features
1、Unique mode achieving automation of head and tail cutting and auto sampling
2、High speed and efficiency, complete all processes in one cutting, with a unit production of ≥ 6GW
3、Automatic centering, combined with multiple auxiliary supports, improves surface verticality and reduces chipping
Dual station cropper QDHS35850
Features
1、Innovative concept, single wire dual workstations, cutting and unloading at the same time, improving automation turnover rate
2、Pre-detection, increasing fixed length segment ratio, with a unit production of ≥ 3GW
3、Back-end loading, equipped with high-precision detection mechanism, with a length error of ≤ 0.2mm
Quad loop-wire squarer QHFA2395
Features
1、Capable of achieving ultra-high unit production capacity of 1GW
2、Equipped with a rotary workbench, with a preparing time of ≤ 30 seconds
3、Simultaneous cutting of four loop-wires, combined with tension control algorithm, with a range error of ≤ 0.15mm
Grinding / chamfering machine LT-GMS2510
Features
1、Automatic loading and centering, intelligent positioning of the work piece and improved compatibility with abnormal ingots.
2、Automatic detection of the margin, intelligent matching of the depth of grinding, improve machining efficiency ≤ 30s
3、Automatic detection of tool wear, intelligent replenishment of wear, and improvement of finished product accuracy
4、Automatic five dimensional correctable feeding table, capable of meeting the minimum unilateral 0.1mm allowance grinding
Slicer QP950
Features
1、Minimum and adjustable horizontal and vertical shaft distance
2、Up to 19 positions available, adjustable shaft distance 310-410mm
3、Fully compatibility with half wafers, full wafers and rectangular wafers
4、Meets the automation requirements of loading and unloading from the front, middle, and back ends
Half wafer slicer QP1200
Features
1、Minimum and adjustable horizontal and vertical shaft distance
2、Half wafer or full wafer spec compatible and up to 19 positions available, adjustable shaft distance 310-410mm
3、Maximum compatible brick length up to 1200mm
4、Meets the automation requirements of loading and unloading from the front, middle, and back ends
Half brick grinding / chamfering machine
Features
1、Fully automatic integrated machine, single station squaring + dual station surface grinding + four station chamfering, comprehensively improving processing efficiency
2、Full detection of work piece length, width, and height, accurate squaring positioning, loop-wire + servo tension mode, improving range error and reducing silicon loss
3、Adoption of roughing and finishing nested type electric spindle, together with the detection and compensation system, to ensure the dimensional accuracy of finished products
4、High unit production capacity, compatible with half brick processing, lower investment and higher output.
