Silicon ingot cropping-Product Center-Linton NC

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The company's business areas involve semiconductor and solar PV monocrystalline silicon growth and silicon wafer cutting and grinding equipment, solar PV silicon wafers, cell cleaning, texturing, etching, module string welding, stack welding equipment, semiconductor thin film growth equipment (ALD) PECVD, LPCVD, etc., new semiconductor material crystal growth and cutting and grinding equipment such as sapphire and SiC, as well as silicon material microwave heating and crushing, argon gas purification and recovery equipment. At the same time, the company has the ability to provide solutions and software and hardware delivery for solar PV smart manufacturing and smart factories under the background of Industry 4.0.

Photovoltaic Equipment

Semiconductor Equipment

Silicon Carbide Equipment

Sapphire Equipment

Customer service center

Single wire cropper

The single loop wire cut-off machine is the equipment to cut and process the monocrystalline silicon ingots through the high-speed unidirectional operation of the diamond wire, which can process different specifications of the silicon ingots, remove the head and tail, take the sample pieces and cutting rework (round rods/square bars).

Double wire cropper

It can process different specifications of the silicon ingots and round ingots, remove the head and tail, take the sample pieces and cutting rework.

Double channel cropper

Duplex cut-off machine has two processing stations for the cut-off of silicon ingots and round ingots with fixed or non-fixed length.

Cropping cluster

Truncation automation production lines

Multiple wire cropper

Used in the Truncation section of the silicon ingot manufacturing process

Loop wire squarer

The loop wire squarer uses a high speed and reciprocating diamond wire to process silicon ingot. which equipped with interchangeable dual-station workbench, loading and unloading silicon ingot through robot and visual positioning.

Grinder

It is used for grinding, polishing and chamfering of silicon ingots. It is an equipment to polish the arc and face of different sizes of monocrystalline silicon square ingots after squaring, with the functions of rough grinding, fine grinding, R-arc and chamfering at the same time, and it can be used as an independent processing equipment, or used as a grinding unit in the factory's automated production line at the same time.

Splitter-grinder

Special equipment used to process the ground silicon ingots into half ingots.

Automatic edge banding line

All three machines adopt a modular design, allowing for switching between cutting, ear removal, and arc removal functions by changing the fixture and material table; all cutting heads are equipped with variable distance function, enabling automatic specification switching, convenient operation, and stable reliability. The three devices further reduce costs through the processing of edge leather.

Brick heater

Apply to silicon bar adhesive section

Contact Information

Dalian Base: No. 40 Yingri Road, Ganjingzi District, Dalian, Liaoning Province

Wuxi Base: No. 15 Jinghong Road, Xishan District, Wuxi, Jiangsu Province
Tel: +86-510-68088419

Email: international_business@linton.group

Stock Code

920368

Contact Information

Dalian Base: No. 40 Yingri Road, Ganjingzi District, Dalian, Liaoning Province

Wuxi Base: No. 15 Jinghong Road, Xishan District, Wuxi, Jiangsu Province
Tel: +86-510-68088419

Email: international_business@linton.group

Stock Code

920368

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Tel

+86-510-68088419

international_business@linton.group

Linton U.S.