Silicon chunk cleaner
Surface cleaning and treatment of solar grade silicon materials, removing solid particles, organics, metal ions and other pollutants and natural oxide film attached to the surface.
Microwave Heating & Water Quenching System
Function: Use physical methods to change the physical structure of silicon materials to make them more fragile.
Principle: Microwave heating followed by pure water quenching is used to change the physical structure of silicon material.
PV mono silicon ingot grower
Compatible with up to 40-inch hot zone to meet the needs of larger feeding volume and larger size monocrystalline silicon ingots growth.
Single wire cropper
The single loop wire cut-off machine is the equipment to cut and process the monocrystalline silicon ingots through the high-speed unidirectional operation of the diamond wire, which can process different specifications of the silicon ingots, remove the head and tail, take the sample pieces and cutting rework (round rods/square bars).
Double wire cropper
It can process different specifications of the silicon ingots and round ingots, remove the head and tail, take the sample pieces and cutting rework.
Double channel cropper
Duplex cut-off machine has two processing stations for the cut-off of silicon ingots and round ingots with fixed or non-fixed length.
Cropping cluster
Truncation automation production lines
Multiple wire cropper
Used in the Truncation section of the silicon ingot manufacturing process
Loop wire squarer
The loop wire squarer uses a high speed and reciprocating diamond wire to process silicon ingot. which equipped with interchangeable dual-station workbench, loading and unloading silicon ingot through robot and visual positioning.
Advanced N-Type Super Thin Wafer Slicer
Used for cutting solar wafer
Magnetic PV mono silicon ingot grower
To meet the demand of low oxygen crystal pulling.
PV mono silicon ingot grower
Compatible with up to 42-inch hot zone to meet the needs of larger feeding volume and larger size monocrystalline silicon ingots growth.
PV mono silicon ingot grower
Compatible with up to 42-inch hot zone to meet the needs of larger feeding volume and larger size monocrystalline silicon ingots growth.
CCz side recharger
Real-time material feeding and doping while ingot growth .
CCz lid recharger
Real-time material feeding and doping while ingot growth .
Grinder
It is used for grinding, polishing and chamfering of silicon ingots. It is an equipment to polish the arc and face of different sizes of monocrystalline silicon square ingots after squaring, with the functions of rough grinding, fine grinding, R-arc and chamfering at the same time, and it can be used as an independent processing equipment, or used as a grinding unit in the factory's automated production line at the same time.
Splitter-grinder
Special equipment used to process the ground silicon ingots into half ingots.
Automatic edge banding line
All three machines adopt a modular design, allowing for switching between cutting, ear removal, and arc removal functions by changing the fixture and material table; all cutting heads are equipped with variable distance function, enabling automatic specification switching, convenient operation, and stable reliability. The three devices further reduce costs through the processing of edge leather.
Brick heater
Apply to silicon bar adhesive section
DW slicer
Used for cutting solar wafer
DW slicer
Used for cutting solar wafer
Half wafer DW slicer
Used for cutting solar wafer
Roll Crushing System
Function: Crushing of wings, rods, and chunk silicon materials.
Principle: Physical crushing by crushing roller extrusion.
Wafer Degluer
Used for the degluing process after wafer slicing, separating wafers from the substrate by softening the adhesive with high temperature.
Wafer Singulator-cleaner
Performs wafer singulation and insertion completing the processes of wafer singulation, wafer insertion into cassettes, cleaning and drying, replacing traditional manual operations.
Wet Method Tank Equipment
Primarily used for texture etching, cleaning andpre-/post-gettering wet processing wafers usedfor monocrystalline silicon solar cell, removing thecutting damage layer and surface contamination.
Wet Chain Equipment
Removes surface PSG/BSG after the diffusionprocess and polishes the wafer surface.
