Silicon chunk cleaner
Surface cleaning and treatment of solar grade silicon materials, removing solid particles, organics, metal ions and other pollutants and natural oxide film attached to the surface.
Microwave Heating & Water Quenching System
Function: Use physical methods to change the physical structure of silicon materials to make them more fragile.
Principle: Microwave heating followed by pure water quenching is used to change the physical structure of silicon material.
PV mono silicon ingot grower
Compatible with up to 40-inch hot zone to meet the needs of larger feeding volume and larger size monocrystalline silicon ingots growth.
Single wire cropper
The single loop wire cut-off machine is the equipment to cut and process the monocrystalline silicon ingots through the high-speed unidirectional operation of the diamond wire, which can process different specifications of the silicon ingots, remove the head and tail, take the sample pieces and cutting rework (round rods/square bars).
Double wire cropper
It can process different specifications of the silicon ingots and round ingots, remove the head and tail, take the sample pieces and cutting rework.
Double channel cropper
Duplex cut-off machine has two processing stations for the cut-off of silicon ingots and round ingots with fixed or non-fixed length.
Cropping cluster
Truncation automation production lines
Multiple wire cropper
Used in the Truncation section of the silicon ingot manufacturing process
Loop wire squarer
The loop wire squarer uses a high speed and reciprocating diamond wire to process silicon ingot. which equipped with interchangeable dual-station workbench, loading and unloading silicon ingot through robot and visual positioning.
Advanced N-Type Super Thin Wafer Slicer
Used for cutting solar wafer
12-inch Czochralski Single Crystal Growing Furnace with Superconducting Magnetic Field
For 12-inch semiconductor grade silicon ingot growth
Czochralski Crystal Growing Furnace for Semiconductor Silicon Parts
For 24-inch semiconductor grade silicon ingot growth
Continuous Czochralski Crystal Growing Furnace
For semiconductor grade crystal growth continuously
Germanium Single Crystal Growing Furnace
Germanium Single Crystal Furnace is designed to melt germanium raw materials through specific processes and grow germanium single crystals with precise control of temperature, atmosphere, and other conditions, achieving specific crystal structures and properties.
Floating Zone melting Single Crystal Furnace
A Floating Zone melting Single Crystal Furnace utilizes high-frequency induction heating to create a suspended molten zone in semiconductor materials, which moves between a seed crystal and a polycrystalline ingot, enabling the growth of high-quality single crystals.
Diamond Wire Cutting Machine
For the cut-off process of semiconductor silicon ingot
Automatic CNC Silicon Ingot Rounding and Granding Machine
For the rounding and grinding process of semiconductor silicon ingot
Vertical CNC Silicon Ingot Rounding and Granding Machine
For the rounding and grinding process of semiconductor silicon ingot
Semiconductor Silicon Slicer
This product is a special equipment for cutting semiconductor monocrystalline silicon wafers using diamond wire, which can process 8-inch and 12-inch silicon ingots, with maximum length of 450mm (crystal orientation deviation angle ≤1°).
Vertical induction furnace for silicon carbide synthesis
Suitable for the synthesis of high-purity SIC raw materials.
SIC Powder purity ≥6N.
Tubular SIC Powder Synthesis Furnace
Suitable for the synthesis of high-purity SIC raw materials.
SIC Powder purity ≥6N.
Magnetic PV mono silicon ingot grower
To meet the demand of low oxygen crystal pulling.
PV mono silicon ingot grower
Compatible with up to 42-inch hot zone to meet the needs of larger feeding volume and larger size monocrystalline silicon ingots growth.
PV mono silicon ingot grower
Compatible with up to 42-inch hot zone to meet the needs of larger feeding volume and larger size monocrystalline silicon ingots growth.
CCz side recharger
Real-time material feeding and doping while ingot growth .
CCz lid recharger
Real-time material feeding and doping while ingot growth .
Grinder
It is used for grinding, polishing and chamfering of silicon ingots. It is an equipment to polish the arc and face of different sizes of monocrystalline silicon square ingots after squaring, with the functions of rough grinding, fine grinding, R-arc and chamfering at the same time, and it can be used as an independent processing equipment, or used as a grinding unit in the factory's automated production line at the same time.
Splitter-grinder
Special equipment used to process the ground silicon ingots into half ingots.
Automatic edge banding line
All three machines adopt a modular design, allowing for switching between cutting, ear removal, and arc removal functions by changing the fixture and material table; all cutting heads are equipped with variable distance function, enabling automatic specification switching, convenient operation, and stable reliability. The three devices further reduce costs through the processing of edge leather.
Brick heater
Apply to silicon bar adhesive section
DW slicer
Used for cutting solar wafer
DW slicer
Used for cutting solar wafer
Half wafer DW slicer
Used for cutting solar wafer
Electrical Resistance Heating SIC Crystal Growing Furnace
Used for 6/8/12 inch conductive and high purity semi-insulating SiC crystal growth, the multi-heater design allows flexible process and thermal field settings, the top loading structure enables convenient open-loading furnace and maintenance operations, while the equipment has high-precision temperature and pressure control capabilities, stable and excellent process performance.
Inductive Heating SIC Crystal Growing Furnace
Suitable for 6-inch and 8-inch conductive and high-purity semi-insulating SiC crystal growth, innovative structural design to provide high-purity material growth capability, with high-precision temperature and pressure control capabilities, excellent process performance, good equipment consistency, and rich experience in mass production.
Electrical Resistance Heating SIC Crystal Growth Furnace with Single Heater
Used for 6/8/12 inch conductive and high purity semi-insulating SiC crystal growth, the multi-heater design allows flexible process and hot zone options, the top loading structure enables convenient furnace loading and maintenance operations, while the equipment has high-precision temperature and pressure control capabilities, stable and excellent process performance.
Electrical Resistance Heating SIC Crystal Growth Furnace with Dual Heaters
Used for 6/8/12 inch conductive and high purity semi-insulating SiC crystal growth, the multi-heater design allows flexible process and hot zone options, the top loading structure enables convenient furnace loading and maintenance operations, while the equipment has high-precision temperature and pressure control capabilities with stable and excellent process performance.
Liquid Phase SIC Crystal Growing Furnace
Suitable for producing high quality 6-inch and 8-inch SIC crystal growth
Horizontal Epitaxial Growth Furnace for SIC Substrate
Suitable for producing high quality 6-inch and 8-inch SIC EPI
Annealing Furnace
Suitable for SIC crystal annealing process
SIC Diamond Wire Cutting Machine
Suitable for SIC crystal Cutting-off process
CNC Flat Grinding Machine
Suitable for SIC crystal Surface granding process
CNC Rolling and Grinding Machine
Suitable for SIC crystal body granding process
SIC Slicer
This product is a special processing equipment for cutting SIC wafers using diamond wire, and can process 6-inch and 8-inch wafers , with a maximum processing length of 300mm.
Kyropoulos Method Sapphire Crystal Growing Furnace
For sapphire crystal growth
Diamond Wire Squaring Machine
Used for sapphire crystal squaring process
CNC Flat Grinding Machine
Used for sapphire crystal flat grinding process
CNC Rolling and Grinding Machine
For sapphire crystal rolling and grinding process
Diamond Wire Slicer
Used in the slicing process of sapphire
Ultra-Hard Stone Wire Saw
Suitable for the cutting of marble blocks, with high yield and eco-friendly.
Roll Crushing System
Function: Crushing of wings, rods, and chunk silicon materials.
Principle: Physical crushing by crushing roller extrusion.
Wafer Degluer
Used for the degluing process after wafer slicing, separating wafers from the substrate by softening the adhesive with high temperature.
Wafer Singulator-cleaner
Performs wafer singulation and insertion completing the processes of wafer singulation, wafer insertion into cassettes, cleaning and drying, replacing traditional manual operations.
Wet Method Tank Equipment
Primarily used for texture etching, cleaning andpre-/post-gettering wet processing wafers usedfor monocrystalline silicon solar cell, removing thecutting damage layer and surface contamination.
Wet Chain Equipment
Removes surface PSG/BSG after the diffusionprocess and polishes the wafer surface.
