Products and Services


The company's business areas involve semiconductor and solar PV monocrystalline silicon growth and silicon wafer cutting and grinding equipment, solar PV silicon wafers, cell cleaning, texturing, etching, module string welding, stack welding equipment, semiconductor thin film growth equipment (ALD) PECVD, LPCVD, etc., new semiconductor material crystal growth and cutting and grinding equipment such as sapphire and SiC, as well as silicon material microwave heating and crushing, argon gas purification and recovery equipment. At the same time, the company has the ability to provide solutions and software and hardware delivery for solar PV smart manufacturing and smart factories under the background of Industry 4.0.

Diamond wire cropper LQJD33250P

Diamond wire cropper LQJD33250P


Equipment advantages
1、The ingot is automatically fed by the truss manipulator, equipped with safety protection net and safety grating;
2、The cutting head adopts the gantry double column structure, the structure is stable and reliable, the failure rate is low, the cutting efficiency is high, the precision is high;
3、The cut ingot is automatically returned to the cutting area, which is convenient for handling. Customers can choose automatic cutting device;
Diamond wire cropper LQJD33250P

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