Products and Services


The company's business areas involve semiconductor and solar PV monocrystalline silicon growth and silicon wafer cutting and grinding equipment, solar PV silicon wafers, cell cleaning, texturing, etching, module string welding, stack welding equipment, semiconductor thin film growth equipment (ALD) PECVD, LPCVD, etc., new semiconductor material crystal growth and cutting and grinding equipment such as sapphire and SiC, as well as silicon material microwave heating and crushing, argon gas purification and recovery equipment. At the same time, the company has the ability to provide solutions and software and hardware delivery for solar PV smart manufacturing and smart factories under the background of Industry 4.0.

Automatic CNC Grinder LQGM2060/3060

Automatic CNC Grinder LQGM2060/3060


Main technical specification
Processing ingot diameter :6-8 "/12"
Processing ingot length :600mm/450mm
Ovality :≤0.06mm
Automatic CNC Grinder LQGM2060/3060

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