Wet chemical texturing equipment
Product function
1.Removing the damaged layer and surface dirt during wiresawing
2.Using strong alkali to etch the crystalline silicon surface to form a regular pyramidal suede, Increasing the absorption of sunlight and reduce the reflectivity of the silicon wafer
3.Increasing the surface area of the silicon wafer, then the PN junction area also increases accordingly
Wet etching equipment
Product function
Removing back PSG and polishing
Wet chemical texturing equipment
Product function
1.Using strong alkali to polish the back of the silicon wafer to form a suede structure similar to a mirror surface to improve wafer's absorption of long wave
2.Increasing the thickness uniformity of the back passivation film
3.Reducing surface area of the back, improving MCLT, and reducing the back recombination rate
RCA Trough cleaning equipment
Product function
1.Removing PSG
2.Removing polycrystalline silicon deposits from the front (LPCVD)PECVD wound coating, and removing the remaining BSG on the surface
Wet chemical texturing equipment
Product function
1.Removing the damaged layer and surface dirt during wiresawing
2.Using strong alkali to etch the crystalline silicon surface to form a regular pyramidal suede, Increasing the absorption of sunlight and reduce the reflectivity of the silicon wafer
3.Increasing the surface area of the silicon wafer, then the PN junction area also increases accordingly
Back polishing and cleaning equipment
Product function
Polishing the wafer
Chemical texturing and cleaning equipment
Product function
The front suede surface of the wafer is generated, and the back area will open
Automatic degumming machine
Product function
Degumming the wafer after slicing
Automatic silicon cleaner
Product function
Main functions: With HF+HNO3 mixed acid corrosion cleaning and reagent (weak acid) soaking, cleaning function
Fully automatic wafer degummer&singulator&cleaner
Equipped with absorbent plate, cassette positioning, slow lifting, drying tank and other patented technology, which can separate wafers efficiently and reduce the broken rate
Japanese Keentu bus communication system and absolute bus servo are adopted, whcih can quickly grasp the processing of production data and achieve intelligent monitoring，which is compatible with various specifications of silicon chip sizes and switching time between different sizes does not exceed 4 hours
Fully automatic wafer degummer&singulator&cleaner
Whole cutter feeding，continuous wafer loading and inserting to improve the production capacity. In addition, through the improvement of the mechanism, the basket changing time is minimized, so that the production capacity of the whole machine is released to the best
Wafer degumming, inserting and cleaing integrated and are automatic, whcih can reduce the turnover link; loading fully automatic, one operator can handle several machines, which can save manpower
